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Electroless-Plated Filler for Lead-Free Composite Solders: Short Review
Materials Engineering, UNIVERSITI MALAYSIA PERLIS, Arau, Perlis, Malaysia
*Email Address : firdausnazeri@unimap.edu.my
Abstract : This work aims to review and provide insight into the electroless-plated fillers for lead-free composite solder applications. The discussion on the basic concept, main experimental parameters, and recent advances in this field are included. The approach includes literature review of the previous works related to electroless-plated fillers, including the common experimental setup and best practices reported. The electroless plating temperature, pH, and specific additives were found to be critical in obtaining a high-quality plating layer. The review also identified several critical improvements seen with the addition of an electroplating layer to the filler, especially on the corrosion resistance, mechanical properties, and intermetallic compound thickness of the solders. The future challenges and room for improvement for the composite solders incorporating an electroless-plated layer are also discussed.
Keywords : Composite solder, Lead-free solder, Electroless plating, Surface treatment, Coating